FPGA Cloud Connectivity Kit 2.0 - The FPGA Cloud Connectivity Kit integrates an Altera® Cyclone® V SoC FPGA with Wi-Fi, Bluetooth, and multiple onboard sensors, providing a ready-to-use platform for cloud-connected IoT edge… Terasic Inc. is a leading provider of FPGA-based hardware platforms, offering a comprehensive portfolio that includes SoC/FPGA development kits, production-ready System-on-Modules (SoMs), and high… Cyclone® V SE SoC FPGA Built on the popular Terasic DE10-Nano, the FPGA Cloud Connectivity Kit combines the versatility of an Altera® Cyclone® V SoC FPGA with certified cloud connectivity to providers like Microsoft Azure. It includes wireless communication via Wi-Fi and Bluetooth, plus sensors for ambient light, temperature, humidity, acceleration, and gyroscopic motion. With open-source design examples, users can quickly learn to connect FPGA-based edge devices to the cloud, collect and analyze IoT data, and build responsive, reconfigurable smart edge solutions. Consumer Industrial Test FPGA Cloud Connectivity Kit 2.0 Key Features Built on DE10‑Nano with Altera® Cyclone® V SoC FPGA Offering Brief No 40-pin expansion headers, One 10-pin Analog input, LTC 2x7 expansion header, Arduino expansion header No No No Cyclone® V SE SoC FPGA No 1GB DDR3, EPCS64, Micro SD card socket 68.6x107mm No HDMI TX, Gigabit Ethernet, Accelerometer, USB OTG, Wi-Fi, Classic Bluetooth (BT) and Bluetooth Low Energy(BLE), 9-axis sensor, Ambient light sensor, UART to USB 20.1.1 Offering Brief Production a1JUi0000049UPsMAM 5V Reset Button, Power Button, Power LED, User-Programmable LEDs, Switch and Button What's Included Documents Ordering Information P0737 314 Direct a1JUi0000049UPsMAM Production Boards / SOMs / Dev Kits a1MUi00000BO8tWMAT a1MUi00000BO8tWMAT Select 2025-08-10T17:15:17.000+0000 The FPGA Cloud Connectivity Kit integrates an Altera® Cyclone® V SoC FPGA with Wi-Fi, Bluetooth, and multiple onboard sensors, providing a ready-to-use platform for cloud-connected IoT edge applications. Partner Solutions