B23C (931) Package Ball Coordinates and Land Pattern Guidance: Agilex® 3 FPGA C-Series Devices - Package Ball Coordinates are spreadsheet documents that provide the X and Y location of the balls for the stated package and are used to generate tool-specific PCB Footprints. Land Pattern and Stencil recommendations are also provided. - 2026-07-10
pbc-lpg-b23c-a3c-v1p5.xlsx
- Version
- 1.5
- Product Type
- Device Families > Agilex Families > Agilex 3 > C-Series
- Resource Type
- Developer Resources > PCB Board Resources > Package Ball Coordinates
- Source Name
- UD