Package Ball Coordinates and PCB Footprint Guidance for MAX® 10 FPGA Package B610 - Package Ball Coordinates are spreadsheet documents that provide the X and Y location of the balls for the stated package and are used to generate tool-specific PCB Footprints. Land Pattern and Stencil recommendations are also provided. - 2025-03-25
pbc-m10-b610-0p9.xlsx
- Version
- 0.9
- Product Type
- Device Families > MAX Families > MAX 10
- Resource Type
- Developer Resources > PCB Board Resources > Package Ball Coordinates
- Source Name
- UD