What package types will the production silicon be assembled in for 5SGXEA4H3F35I3N, 5SGXEA5H3F35I3N and 5SGXEA7H3F35I3N devices? - What package types will the production silicon be assembled in for 5SGXEA4H3F35I3N, 5SGXEA5H3F35I3N and 5SGXEA7H3F35I3N devices? Description Production 5SGXEA4H3F35I3N, 5SGXEA5H3F35I3N and 5SGXEA7H3F35I3N devices will be assembled in Dual Piece Lids (DPL). Resolution For more information on Stratix® V device packaging, refer to the Packaging Device Information web page. Custom Fields values: ['novalue'] Troubleshooting - False ['novalue'] ['novalue'] novalue novalue ['Stratix® V FPGAs', 'Stratix® V GT FPGA'] ['novalue'] ['novalue'] ['novalue']