Package, Mechanical, SMT Resources - Find information on SMT guidelines and other mechanical application resources Quality Pages {"title":"Package, Mechanical, SMT Resources"} Top Mark Layout Packing Information Topics Descriptions Doc Type Shelf-Life and Datecode Control Altera Customer Shipment Component Shelf-Life Blanket Conformance PDF Handling guidelines and tray information AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices HTML three_col_split_table SMT & Board Recommendations Topics Descriptions Doc Type Board Design AN 114: Board Design Guidelines for Altera Programmable Device Packages HTML SMT AN 353: SMT Board Assembly Process recommendations (Legacy Products) PDF MAS: Manufacturing with Stratix® 10 Field Programmable Gate Arrays PDF Thermal, Mechanical AN 657: Thermal Management and Mechanical Handling for FPGA TCFCBGA Devices PDF AN 659: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array PDF KDB: What is the maximum downward pressure that can be applied to the top of FPGA BGA packages? HTML three_col_split_table - 2026-03-10

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