When selecting a heat sink for an Arria II GX lidless package, do I need to be concerned about any exposed substrate de-coupling capacitors? - When selecting a heat sink for an Arria II GX lidless package, do I need to be concerned about any exposed substrate de-coupling capacitors? Description There are no exposed de-coupling capacitors on the substrate on Arria® II GX devices in the lidless package. You should follow the guidelines in AN-358: Thermal Management for FPGAs (PDF) for designing a heat sink for lidless packages. Custom Fields values: ['novalue'] Troubleshooting novalue False ['novalue'] ['novalue'] novalue novalue ['Arria® II GX FPGA'] ['novalue'] ['novalue'] ['novalue']