PRODUCT DISCONTINUANCE NOTIFICATION PDN2007 - is discontinuing part numbers that currently use leaded solder bumps on the 1st level interconnect for the following Field Programmable Gate Array® (FPGA) Flip Chip product families - 2020-06-12
pdn2007.pdf
- Version
- 1.1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Discontinuance Notices (PDN)
- Source Name
- UD