CUSTOMER ADVISORY ADV2001 Pre-alert on End-of-Life (EOL) of Flip Chip Products with Leaded Solder Balls 2nd level interconnect - pre-notified customers of the End-of-Life involving Field Programmable Gate Array (FPGA) Flip Chip products with leaded solder balls as 2nd level interconnect. - 2021-02-12
adv2001.pdf
- Version
- 1.2.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Customer Advisories (ADV)
- Source Name
- UD