PCN2124 MAX® 10 WLCSP RDL/Bump Site Transfer and Package Appearance Change - is announcing a change to the RDL/Bump site and package appearance on selected MAX® 10 products in Wafer Level Chip Scale Package (WLCSP - 2021-05-28
pcn2124.pdf
- Version
- 1.0.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD