PRODUCT DISCONTINUANCE NOTIFICATION PDN2009 - is discontinuing part numbers with leaded solder balls as 2nd level interconnect and eutectic Tin-Lead bumps for 1st level interconnect for the following Field Programmable Gate Array (FPGA) Flip Chip product families - 2020-03-30
pdn2009.pdf
- Version
- 1.0.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Discontinuance Notices (PDN)
- Source Name
- UD