PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES - Altera® is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera® FineLine BGA® (FBGA) device packages - 2006-01-12
pcn0515.pdf
- Version
- 1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD