PCN0708 UPDATE ENCAPSULANT MATERIAL CHANGE FOR BGA Pb-FREE PACKAGES - This is an update to PCN0708, published July 2007. Altera® is implementing encapsulant material changes on the ball-grid array (BGA) Pb-free packages assembled in Amkor Korea and Philippines - 2007-10-22
pcn0708.pdf
- Version
- 1.1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD