PCN0119 FineLine BGA Package Molding Compound Change - ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100 - 2001-11-20
pcn0119.pdf
- Version
- 1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD