PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES - Altera® is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array (PBGA) packaged devices - 2005-12-23
pcn0516.pdf
- Version
- 1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD