PCN0407 UFBGA 88 PACKAGE SUBSTRATE CHANGE - The substrate for the 88 Lead Ultra FineLine BGA® package assembled by Sharp will change from polyimide tape to glass epoxy FR4. This change does not affect form, fit, or function - 2004-05-19
pcn0407.pdf
- Version
- 1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD