PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE - The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera® devices in thin quad flat pack (TQFP) 144 lead packages assembled by Amkor Technology Korea - 2004-03-05
pcn0404.pdf
- Version
- 1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD