PCN0808 WIRE-BOND DIAMETER REDUCTION FOR SELECTED TQFP PACKAGES - Altera® is implementing bond wire diameter reduction from 1.0 mil to 0.8 mil on product lines assembled in the TQFP package - 2008-09-04
pcn0808.pdf
- Version
- 1.0.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD