PCN1801 Capillary Underfill for Thermal Composite Flip Chip Ball Grid Array® (BGA) Packages on Selected Arria®II GX and Arria®V Devices - Programmable Solutions Group (“PSG", formerly Altera®) is announcing a conversion from Molded Underfill to Capillary Underfill in Thermal Composite Flip Chip Ball Grid Array® (BGA) on Arria®II GX and Arria®V devices with the “G” OPN suffix. - 2018-01-26
pcn1801.pdf
- Version
- 1.0.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD