PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA - The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera® FineLine BGA® packages assembled at ASE Malaysia - 2004-11-19
pcn0415.pdf
- Version
- 1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD