PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES - Altera® is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array (BGA), Ultra FineLine Ball-Grid Array® (UBGA), Micro FineLine Ball-Grid Array® (MBGA), and FineLine Ball-Grid Array® (FBGA) packages assembled in both Amkor and ASE manufacturing sites - 2007-10-17
pcn0712.pdf
- Version
- 1.0.1
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD