PCN1106 ADDITIONAL BILL OF MATERIALS AND SUPPLIERS FOR ALTERA®’S FLIP CHIP AND WIREBOND BGA PACKAGES - Altera® introduced additional packaging materials and suppliers for selected flip chip and wirebond BGA packages - 2011-10-05
pcn1106.pdf
- Version
- 1.2.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
- Source Name
- UD