PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES - Altera® will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera®’s Thin Quad Flat Pack (TQFP) packages - 2004-11-17
pcn0414.pdf
- Version
- 1.0
- Product Type
- Resource Type
- Quality > Notifications (PCN, PDN, ADV) > Product Change Notifications (PCN)
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- UD