Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array Application Note - This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball grid array (FCBGA) for Altera® FPGAs. - 2025-06-24
an659.pdf
- Version
- 1.4
- Product Type
- Resource Type
- Documentation > Application Notes
- Source Name
- UD