AN 670: Thermal Solutions to Address Height Variation in Stratix® V Packages - Solution to the problems caused by using a single-piece heatsink on a board that contains various Stratix® V devices with different lid thicknesses. - 2012-10-01
an670.pdf
- Version
- 1.0
- Product Type
- Device Families > Stratix Families > Stratix V
- Resource Type
- Documentation > Application Notes
- Source Name
- UD