AN 353: SMT Board Assembly Process Recommendations - Describes the differences between the conventional soldering and the lead-free soldering. Provides guidelines and recommendations for reflow soldering of lead-free devices. - 2011-10-01

Version

4.0

Product Type

Device Families > Stratix Families > Stratix III

Device Families > Cyclone Families > Cyclone 10 > Cyclone 10 GX

Device Families > Cyclone Families > Cyclone IV

Device Families > Cyclone Families > Cyclone III

Device Families > MAX Families > MAX V

Device Families > MAX Families > MAX 10

Device Families > MAX Families > MAX II

Device Families > Arria Families > Arria 10

Device Families > Cyclone Families > Cyclone V

Device Families > Cyclone Families > Cyclone II

Device Families > Stratix Families > Stratix IV

Device Families > Stratix Families > Stratix V

Device Families > Arria Families > Arria II

Device Families > Cyclone Families > Cyclone 10 > Cyclone 10 LP

Device Families > Arria Families > Arria V

Resource Type

Documentation > Application Notes

Source Name

UD