Does the exposed pad of an EQFP package contribute to thermal dissipation? - Does the exposed pad of an EQFP package contribute to thermal dissipation? Description The exposed pad on EQFP packages is a ground pad that must be connected to the ground plane on your PCB. This exposed pad is used for electrical connectivity only and not for thermal purposes. Custom Fields values: ['novalue'] Troubleshooting novalue False ['novalue'] ['novalue'] novalue novalue ['Cyclone® III FPGAs', 'Cyclone® IV E FPGA', 'MAX® V CPLDs'] ['novalue'] ['novalue'] ['novalue']