10CL040YU484A7G - 10CL040YU484A7G Hi, Could you please help to review the below question and advise? As per supplier : Please advise the lead finishing for this PN#10CL040YU484A7G. If gold, please advise thickness & gold plating process (ENIG: Electroless Nickel Immersion Gold ENEPIG: Electroless Nickel Electroless Palladium Immersion Gold, NiPdAu: Nickel Palladium Gold) Thanks. Regards, Kent Replies: Re: 10CL040YU484A7G I’m glad that your question has been addressed, I now transition this thread to community support. If you have a new question, feel free to open a new thread to get the support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you. Replies: Re: 10CL040YU484A7G Hello, The evaluated packages with matte tin (Sn) and/or Sn-2% copper (Cu) lead finish for leaded packages, and Sn-3-4% silver(Ag)-0.5% Cu solder balls for Pb-free BGA packages. Please refer to this document: https://www.intel.cn/content/dam/www/programmable/us/en/pdfs/literature/wp/wp_chmfgrelldfr.pdf Thank you.