Request of Physical Component Dimensions for 5CGXFC7D6F31I7N - Request of Physical Component Dimensions for 5CGXFC7D6F31I7N We are currently in the process of creating the CAD footprint for the 5CGXFC7D6F31I7N - CYCLONE V FPGA. To proceed, we require the mechanical dimensions of the component. Can anyone please provide the following details: TOTAL THICKNESS STAND OFF SUBSTRATE THICKNESS MOLD THICKNESS BODY SIZE BALL DIAMETER BALL OPENING BALL WIDTH BALL PITCH EDGE BALL CENTER TO CENTER BODY CENTER TO CONTACT BALL PACKAGE EDGE TOLERANCE MOLD FLATNESS COPLANARITY BALL OFFSET (PACKAGE) BALL OFFSET (BALL) Thank you for your time and assistance. Replies: Re: Request of Physical Component Dimensions for 5CGXFC7D6F31I7N Hey good morning, this was the document I was looking for sent for cad creation, thank you so much for sending me this document, I hope you have a wonderful day ahead : ) Replies: Re: Request of Physical Component Dimensions for 5CGXFC7D6F31I7N As we do not receive any response from you on the previous question/reply/answer that we have provided. Please login to ‘ https://supporttickets.intel.com’ , view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions. Replies: Re: Request of Physical Component Dimensions for 5CGXFC7D6F31I7N Hello, You may find the information here : https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/fpga-package-thermal.html regards, Farabi