EPM570F256I5 solder ball composition - EPM570F256I5 solder ball composition Whether there have been any changes in the solder ball composition of the MAX II CPLD EPM570F256I5. Replies: Re: EPM570F256I5 solder ball composition Thank you YuanLi_S_Intel for the fast response. The problem is resolved. Replies: Re: EPM570F256I5 solder ball composition Hi Sir, I have just checked process change notification, there is only a slight increase to the mold compound coverage for the F484, F672 and F896 packages; however, the overall package outline dimensions remain the same. For more information, you may refer to the PCN as stated below: https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pcn1105.pdf Thank You.