Which Intel FPGA device packages are vented? - Which Intel FPGA device packages are vented? Description Some device packages are vented, allowing moinsture to escape during bakeout. Other packages do not require venting. Resolution All lidless flip chip and wire bond packages are non-vented packages. All other/lidded flip chip packages are vented packages. Custom Fields values: ['novalue'] Troubleshooting FB: 457299; False ['novalue'] ['novalue'] novalue novalue ['Programmable Logic Devices'] ['novalue'] ['novalue'] ['novalue']