How much can I expect the solder balls of a BGA package to shrink after reflow? - How much can I expect the solder balls of a BGA package to shrink after reflow? Description You can expect the solder balls of a BGA package to shrink by about a third after reflow. For example, if the solder balls have a height of 0.3mm before reflow, they will shrink to a height of about 0.2mm after reflow. Custom Fields values: ['novalue'] Troubleshooting novalue False ['novalue'] ['novalue'] novalue novalue ['Acex® 1K', 'Apex™ 20K', 'Apex™ II', 'Arria® GX FPGA', 'Arria® II FPGAs', 'Arria® V FPGAs and SoCs', 'Cyclone® FPGAs', 'Cyclone® II FPGAs', 'Cyclone® III FPGAs', 'Cyclone® IV FPGAs', 'Cyclone® V FPGAs and SoCs', 'Arria® 10 FPGAs and SoCs', 'MAX® 10 10 FPGAs', 'MAX® 9000 CPLD', 'MAX® II CPLDs', 'MAX® V CPLDs', 'Stratix® FPGAs', 'Stratix® II FPGAs', 'Stratix® III FPGAs', 'Stratix® IV FPGAs', 'Stratix® V FPGAs'] ['novalue'] ['novalue'] ['novalue']