Lotus Microsystems Thermal Guides - LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components,… Lotus Microsystems develops advanced power delivery solutions for next-generation computing platforms. We design high-performance integrated power modules that combine advanced packaging technology,… Agilex™ 3 FPGA C-Series Agilex™ 5 FPGA D-Series Agilex™ 5 FPGA E-Series Agilex™ 7 FPGA F-Series Agilex™ 7 FPGA I-Series Agilex™ 7 FPGA M-Series Agilex™ 9 FPGA Direct RF-Series Arria® 10 Bare Die Arria® 10 GT FPGA Arria® 10 GX FPGA Arria® 10 SX FPGA Arria® II GX FPGA Arria® II GZ FPGA Arria® V GT FPGA Arria® V GX FPGA Arria® V GZ FPGA Arria® V ST FPGA Arria® V SX FPGA Cyclone® 10 GX FPGA Cyclone® 10 LP FPGA Cyclone® II FPGA Cyclone® III Bare Die Cyclone® III FPGA Cyclone® III LS FPGA Cyclone® IV E FPGA Cyclone® IV GX FPGA Cyclone® V E FPGA Cyclone® V GT FPGA Cyclone® V GX FPGA Cyclone® V SE FPGA Cyclone® V ST FPGA Cyclone® V SX FPGA MAX® 10 FPGA MAX® II CPLD MAX® II Z CPLD MAX® V CPLD Mustang Mesa Stratix® 10 AX FPGA Stratix® 10 Bare Die Stratix® 10 DX FPGA Stratix® 10 GX FPGA Stratix® 10 SX FPGA Stratix® 10 TX FPGA Stratix® III FPGA Stratix® IV E FPGA Stratix® IV GT FPGA Stratix® IV GX FPGA Stratix® V E FPGA Stratix® V GS FPGA Stratix® V GX FPGA eASIC™ N3X Devices eASIC™ N3XS Devices eASIC™ N5X Devices LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated, silicon-based thermal jumpers. They are designed to guide heat away from hot electronic components, toward heat sinks or cooler areas (such as ground planes), without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in scenarios with limited or no direct access to a ground plane or heat sink, such as high-side switch, current sense resistors, power inductors in SMPS and laser diodes Silicon, as an alternative to traditional ceramic materials, offers a cost-effective substrate with high thermal conductivity and excellent thermomechanical properties, as well as reliable manufacturing process. The incorporation of LTG devices both improves circuit reliability and reduces the overall cost of a thermal management system. They are currently available in three standard EIA sizes (0402, 0603, and 0805), as well as custom sizes. Aerospace Consumer Data Center OEM (IHV, ISV, SI, VAR) Defense Industrial Medical Transportation Lotus Microsystems Thermal Guides Key Features Offering Brief No No No No Agilex™ 3 FPGA C-Series Agilex™ 5 FPGA D-Series Agilex™ 5 FPGA E-Series Agilex™ 7 FPGA F-Series Agilex™ 7 FPGA I-Series Agilex™ 7 FPGA M-Series Agilex™ 9 FPGA Direct RF-Series Arria® 10 Bare Die Arria® 10 GT FPGA Arria® 10 GX FPGA Arria® 10 SX FPGA Arria® II GX FPGA Arria® II GZ FPGA Arria® V GT FPGA Arria® V GX FPGA Arria® V GZ FPGA Arria® V ST FPGA Arria® V SX FPGA Cyclone® 10 GX FPGA Cyclone® 10 LP FPGA Cyclone® II FPGA Cyclone® III Bare Die Cyclone® III FPGA Cyclone® III LS FPGA Cyclone® IV E FPGA Cyclone® IV GX FPGA Cyclone® V E FPGA Cyclone® V GT FPGA Cyclone® V GX FPGA Cyclone® V SE FPGA Cyclone® V ST FPGA Cyclone® V SX FPGA MAX® 10 FPGA MAX® II CPLD MAX® II Z CPLD MAX® V CPLD Mustang Mesa Stratix® 10 AX FPGA Stratix® 10 Bare Die Stratix® 10 DX FPGA Stratix® 10 GX FPGA Stratix® 10 SX FPGA Stratix® 10 TX FPGA Stratix® III FPGA Stratix® IV E FPGA Stratix® IV GT FPGA Stratix® IV GX FPGA Stratix® V E FPGA Stratix® V GS FPGA Stratix® V GX FPGA eASIC™ N3X Devices eASIC™ N3XS Devices eASIC™ N5X Devices No No Offering Brief Production a1JUi000007duW9MAI What's Included LTG020180CT a1JUi000007duW9MAI Production Manufacturer a1MUi00000FrVkzMAF a1MUi00000FrVkzMAF Member 2026-03-11T00:04:55.000+0000 LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration. Silicon, used as an alternative to traditional ceramic materials in the construction of thermal jumpers, offers a cost-effective solution with high thermal conductivity and excellent thermomechanical properties, and is reliably processed. The incorporation of LTG devices improves circuit reliability and reduces the overall cost of the thermal management system. They are available in three standard EIA sizes (0201, 0402, 0603: Partner Solutions