Do the package changes or other changes described in Intel® Product Discontinuation Notice PDN1926 change the thermal characteristics of the affected devices? - Do the package changes or other changes described in Intel® Product Discontinuation Notice PDN1926 change the thermal characteristics of the affected devices? Description No. Intel® PDN1926 provides notification of changes for several device families: Arria® II GX Arria® V Stratix® III Stratix® IV For the Arria V and Stratix III devices, the package changes from a lidless package to a molded thermal composite package that is also lidless. These changes do not affect the thermal performance of the devices, and their thermal resistance specifications are unchanged. The figure shows the lidless package (N) and the molded thermal composite package (G). Note that both packages feature direct thermal contact with the die. Resolution These changes do not affect the thermal performance of the devices, and their thermal resistance specifications are unchanged. Custom Fields values: ['novalue'] Troubleshooting 15013048761 False ['novalue'] ['FPGA Dev Tools Quartus® Prime Software Pro'] novalue 19.1 ['Arria® II GX FPGA', 'Arria® V FPGAs and SoCs', 'Stratix® III FPGAs', 'Stratix® IV FPGAs'] ['novalue'] ['novalue'] ['novalue']