FPGA Package and Thermal Information - Links to access available information on package and thermal information by FPGA Device Family. Package and thermal information for FPGAs, CPLD, ASIC, and configuration devices. Design Pages {"title":"FPGA Package and Thermal Information"} Agilex ™ 7 Family Agilex™ 5 Family Agilex™ 3 Family Package Mechanical Drawings Package Mechanical Drawings Package Mechanical Drawings Package Ball Coordinate Lists Package Ball Coordinate Lists Package Ball Coordinate Lists Manufacturing Advantage Services (MAS) 1 Manufacturing Advantage Services (MAS) 1 Manufacturing Advantage Services (MAS) 1 Compact Thermal Models 1 Compact Thermal Models 1 Compact Thermal Models 1 Note 1 – Compact Thermal Models and MAS documents for Agilex™ Devices are restricted access, please sign in or register to access. Stratix® Series Arria® Series Cyclone® Series MAX® Series Serial Configuration Devices Stratix® 10 devices Arria® 10 devices Cyclone® 10 devices MAX® 10 devices EPCQ-A Stratix® V devices Arria® V devices Cyclone® V devices MAX® V devices EPCQ-L Stratix® IV devices Arria® II devices Cyclone® IV devices MAX® II devices EPCQ Stratix® III devices Cyclone® III devices EPCS Cyclone® II devices For PCB Manufacturing Information and Resources visit the Board Developer Center . For other devices not listed in Table 1, please see the Package Information Datasheet for Mature devices , or visit the FPGA device and support collection to find more information about Mature and Legacy Device Support Collections.