Need PCB land pattern for part EP4CE6F17C8N - Need PCB land pattern for part EP4CE6F17C8N Hello Team, Please share the recommended land pattern for part EP4CE6F17C8N. Thanks, Aman Arab Replies: Re: Need PCB land pattern for part EP4CE6F17C8N BGA pin numbering is alphanumerical (A1..A16, B1..) etc., it's specified in above linked package drawing, please review. Pinout is described in separate documents, browse https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/lit-dp.html Replies: Re: Need PCB land pattern for part EP4CE6F17C8N Hello Team, Any updates on the requested PINs details? Thanks, Aman Arab Replies: Re: Need PCB land pattern for part EP4CE6F17C8N Hello Farabi, Thank you for your response. We kindly request the pin numbering details from pin 1 to pin 256, along with the corresponding pin functions/significance for each. This information is essential for our analysis and proper integration. The details you shared are helpful in understanding the footprint only. Thanks, Aman Arab Replies: Re: Need PCB land pattern for part EP4CE6F17C8N Hi Aman, Please refer to attached package drawing for land pattern recommendation. link : https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04R00230-03.pdf FBGA-256 Ball Grid Array- 0.8mm pitch Ball pitch = 0.8mm Pad(Land) Diameter = 0.3mm to 0.35mm Solder Mask Opening = 0.4mm Pad Type = NSMD (Non-Solder Mask Defined) recommended NSMD Pad size = 0.30mm to 0.33mm diameter Solder Mask Clearance = +0.05mm all around pad Package size = 17mm x 17mm regards, Farabi