What is the shelf life of a ball-grid array (BGA) device after removing it from its dry pack? - What is the shelf life of a ball-grid array (BGA) device after removing it from its dry pack? Description The labels on these dry packs specify the floor life (in factory conditions: <30 °C and <65% relative humidity) for the device from the time when it is removed from the bag. You can find more information about handling moisture-sensitive devices in Application Note 71: Guidelines for Handling J-Lead, QFP & BGA packages . Altera ships its moisture-sensitive packages in dry packs in order to protect the devices from any moisture-related risks. Damage may occur when a plastic device that has absorbed moisture is subject to the high heat from the reflow soldering process. Custom Fields values: ['novalue'] Troubleshooting novalue False ['novalue'] ['novalue'] novalue novalue ['Programmable Logic Devices'] ['novalue'] ['novalue'] ['novalue']