BGA ball composition and melting point for MPN: 5M160ZM100C5N - BGA ball composition and melting point for MPN: 5M160ZM100C5N As below information is unable found in the datasheet, pls help to check & provide BGA ball composition and melting point for MPN: 5M160ZM100C5N. Replies: Re: BGA ball composition and melting point for MPN: 5M160ZM100C5N We do not receive any response from you to the previous question/reply/answer that I have provided. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you. Replies: Re: BGA ball composition and melting point for MPN: 5M160ZM100C5N Hi Supeng, The BGA ball composition for MAX V CPLD is Sn:Ag:Cu = 96.5:3.0:0.5. The melting point of SAC305 solder ball is 217'C. Regards, Aqid Ayman Replies: Re: BGA ball composition and melting point for MPN: 5M160ZM100C5N Hi Supeng, Thank you for reaching out to Intel FPGA Community. For your request, I need to check with the respective team. I will provide the information once I received it as soon as possible. Regards, Aqid Ayman