Which type of 256-pin ball-grid array (BGA) package is used for the MAX® EPM7512AE and EPM7512B devices? - Which type of 256-pin ball-grid array (BGA) package is used for the MAX® EPM7512AE and EPM7512B devices? Description The packaging data sheet shows two package dimensions for the 256-pin BGA: - 256-pin thermally enhanced BGA cavity down - 256-pin non-thermally enhanced BGA cavity up Both MAX EPM7512AE and EPM7512B devices use the 256-pin thermally enhanced BGA cavity down. Note: The only physical dimension that differs between the two packages is the package height. All other dimensions are identical. Custom Fields values: ['novalue'] Troubleshooting novalue False ['novalue'] ['novalue'] novalue novalue ['Programmable Logic Devices'] ['novalue'] ['novalue'] ['novalue']