| CFD |
Computational Fluid Dynamic, a numerical analysis method for solving the conjugated heat transfer problems. |
| CTM |
Compact Thermal Model, a geometric model that is used as an input to CFD tool. |
| DTS |
Digital thermal sensor. |
| FAE |
Field application engineer. |
| FPGA |
Field Programmable Gate Array. |
| HBM |
High Bandwidth Memory. |
| IHS |
Integrated Heat Spreader - case of an FPGA. |
| MCM |
Multi-Chip Module - an integrated circuit (IC) with more than one die. |
| PTC |
Power and Thermal Calculator. |
| RTL |
Register-transfer level. |
| SCM |
Single Chip Module. |
| TCASE
|
Integrated Heat Spreader or Case Temperature. The case temperature of a component is measured with an attached heat sink. This temperature is measured at the top geometric center of the package case/die. |
| TTP |
The total power dissipation of the device. This includes static power, with static power savings subtracted. The PTC reports this value in the Power Summary window. |
| TDP |
Thermal Design Power, the power dissipated in a die that is used for thermal analysis purposes. |
| TA
|
Ambient Temperature, measured locally surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink. |
| TCORE
|
Core Fabric Die Temperature. |
| TJ
|
Junction Temperature. |
| TJ-MAX
|
Maximum Junction Temperature, a maximum allowable absolute temperature rating of the device or a targeted value. |
| TIM |
Thermal Interface Material. |
| TSD |
Temperature Sensor Diode. |
| VID |
Voltage identification code. |