Cyclone® 10 GX Core Fabric and General Purpose I/Os Handbook - Provides information about the Cyclone® 10 GX device family core fabric features, hard IP blocks, input and output interfaces, device configuration, power management, and guidelines for system integration. - 2026-04-28
1. Logic Array Blocks and Adaptive Logic Modules in Cyclone® 10 GX Devices
1.1. LAB
1.1.1. MLAB
1.1.2. Local and Direct Link Interconnects
1.1.3. Shared Arithmetic Chain and Carry Chain Interconnects
1.1.4. LAB Control Signals
1.1.5. ALM Resources
1.1.6. ALM Output
1.2. ALM Operating Modes
1.2.1. Normal Mode
1.2.2. Extended LUT Mode
1.2.3. Arithmetic Mode
1.2.4. Shared Arithmetic Mode
1.3. LAB Power Management Techniques
1.4. Logic Array Blocks and Adaptive Logic Modules in Cyclone® 10 GX Devices Revision History
2. Embedded Memory Blocks in Cyclone® 10 GX Devices
2.1. Types of Embedded Memory
2.1.1. Embedded Memory Capacity in Cyclone® 10 GX Devices
2.2. Embedded Memory Design Guidelines for Cyclone® 10 GX Devices
2.2.1. Consider the Memory Block Selection
2.2.2. Guideline: Implement External Conflict Resolution
2.2.3. Guideline: Customize Read-During-Write Behavior
2.2.3.1. Same-Port Read-During-Write Mode
2.2.3.2. Mixed-Port Read-During-Write Mode
2.2.4. Guideline: Consider Power-Up State and Memory Initialization
2.2.5. Guideline: Control Clocking to Reduce Power Consumption
2.3. Embedded Memory Features
2.4. Embedded Memory Modes
2.4.1. Embedded Memory Configurations for Single-port Mode
2.4.2. Embedded Memory Configurations for Dual-port Modes
2.5. Embedded Memory Clocking Modes
2.5.1. Clocking Modes for Each Memory Mode
2.5.1.1. Single Clock Mode
2.5.1.2. Read/Write Clock Mode
2.5.1.3. Input/Output Clock Mode
2.5.1.4. Independent Clock Mode
2.5.2. Asynchronous Clears in Clocking Modes
2.5.3. Output Read Data in Simultaneous Read/Write
2.5.4. Independent Clock Enables in Clocking Modes
2.6. Parity Bit in Embedded Memory Blocks
2.7. Byte Enable in Embedded Memory Blocks
2.7.1. Byte Enable Controls in Memory Blocks
2.7.2. Data Byte Output
2.7.3. RAM Blocks Operations
2.8. Memory Blocks Packed Mode Support
2.9. Memory Blocks Address Clock Enable Support
2.10. Memory Blocks Asynchronous Clear
2.11. Memory Blocks Error Correction Code Support
2.11.1. Error Correction Code Truth Table
2.12. Embedded Memory Blocks in Cyclone® 10 GX Devices Revision History
3. Variable Precision DSP Blocks in Cyclone® 10 GX Devices
3.1. Supported Operational Modes in Cyclone® 10 GX Devices
3.1.1. Features
3.2. Resources
3.3. Design Considerations
3.3.1. Operational Modes
3.3.2. Internal Coefficient and Pre-Adder for Fixed-Point Arithmetic
3.3.3. Accumulator for Fixed-Point Arithmetic
3.3.4. Chainout Adder
3.3.4.1. Resources
3.3.5. DSP Block Cascade Limit in Cyclone® 10 GX Devices
3.4. Block Architecture
3.4.1. Input Register Bank
3.4.1.1. Two Sets of Delay Registers for Fixed-Point Arithmetic
3.4.2. Pipeline Register
3.4.3. Pre-Adder for Fixed-Point Arithmetic
3.4.4. Internal Coefficient for Fixed-Point Arithmetic
3.4.5. Multipliers
3.4.6. Adder
3.4.7. Accumulator and Chainout Adder for Fixed-Point Arithmetic
3.4.8. Systolic Registers for Fixed-Point Arithmetic
3.4.9. Double Accumulation Register for Fixed-Point Arithmetic
3.4.10. Output Register Bank
3.5. Operational Mode Descriptions
3.5.1. Operational Modes for Fixed-Point Arithmetic
3.5.1.1. Independent Multiplier Mode
3.5.1.1.1. 18 x 18 or 18 x 19 Independent Multiplier
3.5.1.1.2. 27 x 27 Independent Multiplier
3.5.1.2. Independent Complex Multiplier
3.5.1.2.1. 18 x 19 Complex Multiplier
3.5.1.3. Multiplier Adder Sum Mode
3.5.1.4. 18 x 19 Multiplication Summed with 36-Bit Input Mode
3.5.1.5. Systolic FIR Mode
3.5.1.5.1. Mapping Systolic Mode User View to Variable Precision Block Architecture View
3.5.1.5.2. 18-Bit Systolic FIR Mode
3.5.1.5.3. 27-Bit Systolic FIR Mode
3.5.2. Operational Modes for Floating-Point Arithmetic
3.5.2.1. Single Floating-Point Arithmetic Functions
3.5.2.1.1. Multiplication Mode
3.5.2.1.2. Adder or Subtract Mode
3.5.2.1.3. Multiply Accumulate Mode
3.5.2.2. Multiple Floating-Point Arithmetic Functions
3.5.2.2.1. Multiply-Add or Multiply-Subtract Mode
3.5.2.2.2. Vector One Mode
3.5.2.2.3. Vector Two Mode
3.5.2.2.4. Direct Vector Dot Product
3.5.2.2.5. Complex Multiplication
3.6. Variable Precision DSP Blocks in Cyclone® 10 GX Devices Revision History
4. Clock Networks and PLLs in Cyclone® 10 GX Devices
4.1. Clock Networks
4.1.1. Clock Resources in Cyclone® 10 GX Devices
4.1.2. Hierarchical Clock Networks
4.1.3. Types of Clock Networks
4.1.3.1. Global Clock Networks
4.1.3.2. Regional Clock Networks
4.1.3.3. Periphery Clock Networks
4.1.4. Clock Network Sources
4.1.4.1. Dedicated Clock Input Pins
4.1.4.2. Internal Logic
4.1.4.3. DPA Outputs
4.1.4.4. HSSI Clock Outputs
4.1.4.5. PLL Clock Outputs
4.1.5. Clock Control Block
4.1.5.1. Pin Mapping in Cyclone® 10 GX Devices
4.1.5.2. GCLK Control Block
4.1.5.3. RCLK Control Block
4.1.5.4. PCLK Control Block
4.1.6. Clock Power Down
4.1.7. Clock Enable Signals
4.2. Cyclone® 10 GX PLLs
4.2.1. PLL Usage
4.2.2. PLL Architecture
4.2.3. PLL Control Signals
4.2.3.1. Reset
4.2.3.2. Locked
4.2.4. Clock Feedback Modes
4.2.5. Clock Multiplication and Division
4.2.6. Programmable Phase Shift
4.2.7. Programmable Duty Cycle
4.2.8. PLL Cascading
4.2.9. Reference Clock Sources
4.2.10. Clock Switchover
4.2.10.1. Automatic Switchover
4.2.10.2. Automatic Switchover with Manual Override
4.2.10.3. Manual Clock Switchover
4.2.10.4. Guidelines
4.2.11. PLL Reconfiguration and Dynamic Phase Shift
4.3. Clock Networks and PLLs in Cyclone® 10 GX Devices Revision History
5. I/O and High Speed I/O in Cyclone® 10 GX Devices
5.1. I/O and Differential I/O Buffers in Cyclone® 10 GX Devices
5.2. I/O Standards and Voltage Levels in Cyclone® 10 GX Devices
5.2.1. I/O Standards Support in Cyclone® 10 GX Devices
5.2.2. I/O Standards Voltage Levels in Cyclone® 10 GX Devices
5.3. Altera FPGA I/O IPs for Cyclone® 10 GX Devices
5.4. I/O Resources in Cyclone® 10 GX Devices
5.4.1. GPIO Banks, SERDES, and DPA Locations in Cyclone® 10 GX Devices
5.4.2. FPGA I/O Resources in Cyclone® 10 GX Packages
5.4.3. I/O Banks Groups in Cyclone® 10 GX Devices
5.4.4. I/O Vertical Migration for Cyclone® 10 GX Devices
5.4.4.1. Verifying Pin Migration Compatibility
5.5. Architecture and General Features of I/Os in Cyclone® 10 GX Devices
5.5.1. I/O Element Structure in Cyclone® 10 GX Devices
5.5.1.1. I/O Bank Architecture in Cyclone® 10 GX Devices
5.5.1.2. I/O Buffer and Registers in Cyclone® 10 GX Devices
5.5.2. Features of I/O Pins in Cyclone® 10 GX Devices
5.5.2.1. Open-Drain Output
5.5.2.2. Bus-Hold Circuitry
5.5.2.3. Weak Pull-up Resistor
5.5.3. Programmable IOE Features in Cyclone® 10 GX Devices
5.5.3.1. Programmable Current Strength
5.5.3.2. Programmable Output Slew Rate Control
5.5.3.3. Programmable IOE Delay
5.5.3.4. Programmable Open-Drain Output
5.5.3.5. Programmable Pre-Emphasis
5.5.3.6. Programmable Differential Output Voltage
5.5.4. On-Chip I/O Termination in Cyclone® 10 GX Devices
5.5.4.1. RS OCT without Calibration in Cyclone® 10 GX Devices
5.5.4.2. RS OCT with Calibration in Cyclone® 10 GX Devices
5.5.4.3. RT OCT with Calibration in Cyclone® 10 GX Devices
5.5.4.4. Dynamic OCT
5.5.4.5. Differential Input RD OCT
5.5.4.6. OCT Calibration Block in Cyclone® 10 GX Devices
5.5.5. External I/O Termination for Cyclone® 10 GX Devices
5.5.5.1. Single-Ended I/O Termination
5.5.5.2. Differential I/O Termination for Cyclone® 10 GX Devices
5.5.5.2.1. Differential HSTL, SSTL, HSUL, and POD Termination
5.5.5.2.2. LVDS, RSDS, and Mini-LVDS Termination
5.5.5.2.3. LVPECL Termination
5.6. High Speed Source-Synchronous SERDES and DPA in Cyclone® 10 GX Devices
5.6.1. Cyclone® 10 GX LVDS SERDES Usage Modes
5.6.2. SERDES Circuitry
5.6.3. SERDES I/O Standards Support in Cyclone® 10 GX Devices
5.6.4. Differential Transmitter in Cyclone® 10 GX Devices
5.6.4.1. Transmitter Blocks in Cyclone® 10 GX Devices
5.6.4.2. Serializer Bypass for DDR and SDR Operations
5.6.5. Differential Receiver in Cyclone® 10 GX Devices
5.6.5.1. Receiver Blocks in Cyclone® 10 GX Devices
5.6.5.1.1. DPA Block
5.6.5.1.2. Synchronizer
5.6.5.1.3. Data Realignment Block (Bit Slip)
5.6.5.1.4. Deserializer
5.6.5.2. Receiver Modes in Cyclone® 10 GX Devices
5.6.5.2.1. Non-DPA Mode
5.6.5.2.2. DPA Mode
5.6.5.2.3. Soft-CDR Mode
5.6.6. PLLs and Clocking for Cyclone® 10 GX Devices
5.6.6.1. Clocking Differential Transmitters
5.6.6.2. Clocking Differential Receivers
5.6.6.2.1. Guideline: Clocking DPA Interfaces Spanning Multiple I/O Banks
5.6.6.2.2. Guideline: I/O PLL Reference Clock Source for DPA or Non-DPA Receiver
5.6.6.3. Guideline: LVDS Reference Clock Source
5.6.6.4. Guideline: Use PLLs in Integer PLL Mode for LVDS
5.6.6.5. Guideline: Use High-Speed Clock from PLL to Clock LVDS SERDES Only
5.6.6.6. Guideline: Pin Placement for Differential Channels
5.6.6.7. LVDS Interface with External PLL Mode
5.6.6.7.1. IOPLL IP Signal Interface with LVDS SERDES IP
5.6.6.7.2. IOPLL Parameter Values for External PLL Mode
5.6.6.7.3. Connection between IOPLL and LVDS SERDES in External PLL Mode
5.6.7. Timing and Optimization for Cyclone® 10 GX Devices
5.6.7.1. Source-Synchronous Timing Budget
5.6.7.1.1. Differential Data Orientation
5.6.7.1.2. Differential I/O Bit Position
5.6.7.1.2.1. Differential Bit Naming Conventions
5.6.7.1.3. Transmitter Channel-to-Channel Skew
5.6.7.1.4. Receiver Skew Margin for Non-DPA Mode
5.6.7.1.4.1. RSKM Equation
5.7. Using the I/Os and High Speed I/Os in Cyclone® 10 GX Devices
5.7.1. I/O and High-Speed I/O General Guidelines for Cyclone® 10 GX Devices
5.7.1.1. Guideline: VREF Sources and VREF Pins
5.7.1.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
5.7.1.3. Guideline: I/O Standards Supported for I/O PLL Reference Clock Input Pin
5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards
5.7.2.1. Non-Voltage-Referenced I/O Standards
5.7.2.2. Voltage-Referenced I/O Standards
5.7.2.3. Mixing Voltage-Referenced and Non-Voltage Referenced I/O Standards
5.7.3. Guideline: Maximum Current Driving I/O Pins While Turned Off and During Power Sequencing
5.7.4. Guideline: Maximum DC Current Restrictions
5.7.5. Guideline: LVDS SERDES IP Instantiation
5.7.6. Guideline: LVDS SERDES Pin Pairs for Soft-CDR Mode
5.7.7. Guideline: Minimizing High Jitter Impact on Cyclone® 10 GX GPIO Performance
5.7.8. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
5.8. I/O and High Speed I/O in Cyclone® 10 GX Devices Revision History
6. External Memory Interfaces in Cyclone® 10 GX Devices
6.1. Key Features of the Cyclone® 10 GX External Memory Interface Solution
6.2. Memory Standards Supported by Cyclone® 10 GX Devices
6.3. External Memory Interface Widths in Cyclone® 10 GX Devices
6.4. External Memory Interface I/O Pins in Cyclone® 10 GX Devices
5.7.8. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
6.5. Memory Interfaces Support in Cyclone® 10 GX Device Packages
6.5.1. Cyclone® 10 GX Package Support for DDR3/DDR3L x40 with ECC or LPDDR3 x32 without ECC
6.5.2. Cyclone® 10 GX Package Support for DDR3/DDR3L ×72 with ECC Single and Dual-Rank
6.6. External Memory Interface IP Support in Cyclone® 10 GX Devices
6.6.1. Ping Pong PHY IP
6.7. External Memory Interface Architecture of Cyclone® 10 GX Devices
6.7.1. I/O Bank
6.7.1.1. Hard Memory Controller
6.7.1.1.1. Hard Memory Controller Features
6.7.1.1.2. Main Control Path
6.7.1.1.3. Data Buffer Controller
6.7.1.2. Delay-Locked Loop
6.7.1.3. Sequencer
6.7.1.4. Clock Tree
6.7.1.5. I/O Lane
6.7.1.5.1. DQS Logic Block
6.7.1.5.1.1. DQS Delay Chain
6.7.2. I/O AUX
6.8. External Memory Interfaces in Cyclone® 10 GX Devices Revision History
7. Configuration, Design Security, and Remote System Upgrades in Cyclone® 10 GX Devices
7.1. Enhanced Configuration and Configuration via Protocol
7.2. Configuration Schemes
7.2.1. Active Serial Configuration
7.2.1.1. DATA Clock (DCLK)
7.2.1.2. Active Serial Single-Device Configuration
7.2.1.3. Active Serial Multi-Device Configuration
7.2.1.3.1. Pin Connections and Guidelines
7.2.1.3.2. Using Multiple Configuration Data
7.2.1.4. Active Serial Configuration with Multiple EPCQ-L Devices
7.2.1.5. Using EPCQ-L Devices
7.2.1.5.1. Controlling EPCQ-L Devices
7.2.1.5.2. Trace Length Guideline
7.2.1.5.3. Programming EPCQ-L Devices
7.2.1.5.3.1. Programming EPCQ-L Using the JTAG Interface
7.2.1.5.3.2. Programming EPCQ-L Using the Active Serial Interface
7.2.2. Passive Serial Configuration
7.2.2.1. Passive Serial Single-Device Configuration Using an External Host
7.2.2.2. Passive Serial Single-Device Configuration Using an FPGA Download Cable
7.2.2.3. Passive Serial Multi-Device Configuration
7.2.2.3.1. Pin Connections and Guidelines
7.2.2.3.2. Using Multiple Configuration Data
7.2.2.3.3. Using One Configuration Data
7.2.2.3.4. Using PC Host and Download Cable
7.2.3. Fast Passive Parallel Configuration
7.2.3.1. Fast Passive Parallel Single-Device Configuration
7.2.3.2. Fast Passive Parallel Multi-Device Configuration
7.2.3.2.1. Pin Connections and Guidelines
7.2.3.2.2. Using Multiple Configuration Data
7.2.3.2.3. Using One Configuration Data
7.2.4. JTAG Configuration
7.2.4.1. JTAG Single-Device Configuration
7.2.4.2. JTAG Multi-Device Configuration
7.2.4.2.1. Pin Connections and Guidelines
7.2.4.2.2. Using a Download Cable
7.3. Configuration Details
7.3.1. MSEL Pin Settings
7.3.2. CLKUSR
7.3.3. Configuration Sequence
7.3.3.1. Power Up
7.3.3.2. Reset
7.3.3.3. Configuration
7.3.3.3.1. Configuration Error Detection
7.3.3.4. Configuration Error Handling
7.3.3.5. Initialization
7.3.3.6. User Mode
7.3.4. Configuration Timing Waveforms
7.3.4.1. FPP Configuration Timing
7.3.4.2. AS Configuration Timing
7.3.4.3. PS Configuration Timing
7.3.5. Estimating Configuration Time
7.3.6. Device Configuration Pins
7.3.6.1. I/O Standards and Drive Strength for Configuration Pins
7.3.6.2. Configuration Pin Options in the Quartus® Prime Pro Edition Software
7.3.7. Configuration Data Compression
7.3.7.1. Enabling Compression Before Design Compilation
7.3.7.2. Enabling Compression After Design Compilation
7.3.7.3. Using Compression in Multi-Device Configuration
7.4. Remote System Upgrades Using Active Serial Scheme
7.4.1. Configuration Images
7.4.2. Configuration Sequence in the Remote Update Mode
7.4.3. Remote System Upgrade Circuitry
7.4.4. Enabling Remote System Upgrade Circuitry
7.4.5. Remote System Upgrade Registers
7.4.5.1. Control Register
7.4.5.2. Status Register
7.4.6. Remote System Upgrade State Machine
7.4.7. User Watchdog Timer
7.5. Design Security
7.5.1. Security Key Types
7.5.2. Security Modes
7.5.2.1. JTAG Secure Mode
7.5.3. Cyclone® 10 GX Qcrypt Security Tool
7.5.4. Design Security Implementation Steps
7.6. Configuration, Design Security, and Remote System Upgrades in Cyclone® 10 GX Devices Revision History
8. SEU Mitigation for Cyclone® 10 GX Devices
8.1. Mitigating Single Event Upset
8.1.1. Configuration RAM
8.1.2. Embedded Memory
8.1.3. Failure Rates
8.2. Cyclone® 10 GX SEU Mitigation Techniques
8.2.1. Mitigating SEU Effects in Configuration RAM
8.2.1.1. Error Detection Cyclic Redundancy Check
8.2.1.1.1. Column-Based and Frame-Based Check-Bits
8.2.1.1.2. Error Message Register
8.2.1.1.2.1. Retrieving Error Information
8.2.1.1.2.2. Error Type in EMR
8.2.1.1.3. CRC_ERROR Pin Behavior
8.2.1.2. SEU Sensitivity Processing
8.2.1.3. Hierarchy Tagging
8.2.1.4. Evaluating Your System’s Response to Functional Upsets
8.2.1.5. Recovering from CRC Errors
8.2.1.5.1. Enabling Error Correction (Internal Scrubbing)
8.2.2. Mitigating SEU Effects in Embedded User RAM
8.2.2.1. Configuring RAM to Enable ECC
8.2.3. Triple-Module Redundancy
8.2.4. Quartus® Prime Pro Edition Software SEU FIT Reports
8.2.4.1. SEU FIT Parameters Report
8.2.4.2. Projected SEU FIT by Component Usage Report
8.2.4.2.1. Component FIT Rates
8.2.4.2.2. Raw FIT
8.2.4.2.3. Utilized FIT
8.2.4.2.3.1. Comparing .smh Critical Bits Report to Utilized Bit Count
8.2.4.2.3.2. Considerations for Small Designs
8.2.4.2.4. Mitigated FIT
8.2.4.2.5. Architectural Vulnerability Factor
8.2.4.3. Enabling the Projected SEU FIT by Component Usage Report
8.3. CRAM Error Detection Settings Reference
8.4. Specifications
8.4.1. Error Detection Frequency
8.4.2. Error Detection Time
8.4.3. EMR Update Interval
8.4.4. Error Correction Time
8.5. SEU Mitigation for Cyclone® 10 GX Devices Revision History
9. JTAG Boundary-Scan Testing in Cyclone® 10 GX Devices
9.1. BST Operation Control
9.1.1. IDCODE
9.1.2. Supported JTAG Instruction
9.1.3. JTAG Secure Mode
9.1.4. JTAG Private Instruction
9.2. I/O Voltage for JTAG Operation
9.3. Performing BST
9.4. Enabling and Disabling IEEE Std. 1149.1 BST Circuitry
9.5. Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing
9.6. IEEE Std. 1149.1 Boundary-Scan Register
9.6.1. Boundary-Scan Cells of a Cyclone® 10 GX Device I/O Pin
9.7. IEEE Std. 1149.6 Boundary-Scan Register
9.8. JTAG Boundary-Scan Testing in Cyclone® 10 GX Devices Revision History
10. Power Management in Cyclone® 10 GX Devices
10.1. Power Consumption
10.1.1. Dynamic Power Equation
10.2. Programmable Power Technology
10.3. Power Sense Line
10.4. Voltage Sensor
10.4.1. Input Signal Range for External Analog Signal
10.4.1.1. Unipolar Input Mode
10.4.2. Using Voltage Sensor in Cyclone® 10 GX Devices
10.4.2.1. Accessing the Voltage Sensor Using FPGA Core Access
10.4.2.1.1. Configuration Registers for the Core Access Mode
10.4.2.1.2. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is not Equal to 2'b11
10.4.2.1.3. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is Equal to 2'b11
10.4.2.2. Voltage Sensor Transfer Function
10.5. Temperature Sensing Diode
10.5.1. Internal Temperature Sensing Diode
10.5.1.1. Transfer Function for Internal TSD
10.5.2. External Temperature Sensing Diode
10.6. Power-On Reset Circuitry
10.6.1. Power Supplies Monitored and Not Monitored by the POR Circuitry
10.7. Power Sequencing Considerations for Cyclone® 10 GX Devices
10.7.1. Power-Up Sequence Requirements for Cyclone® 10 GX Devices
10.7.2. Power-Down Sequence Recommendations and Requirements for Cyclone® 10 GX Devices
10.8. Power Supply Design
10.9. Power Management in Cyclone® 10 GX Devices Revision History