Cyclone 10 GX Core Fabric and General Purpose I/Os Handbook - Provides information about the Cyclone 10 GX device family core fabric features, hard IP blocks, input and output interfaces, device configuration, power management, and guidelines for system integration. - 2025-05-16
1. Logic Array Blocks and Adaptive Logic Modules in Cyclone 10 GX Devices
1.1. LAB
1.1.1. MLAB
1.1.2. Local and Direct Link Interconnects
1.1.3. Shared Arithmetic Chain and Carry Chain Interconnects
1.1.4. LAB Control Signals
1.1.5. ALM Resources
1.1.6. ALM Output
1.2. ALM Operating Modes
1.2.1. Normal Mode
1.2.2. Extended LUT Mode
1.2.3. Arithmetic Mode
1.2.4. Shared Arithmetic Mode
1.3. LAB Power Management Techniques
1.4. Logic Array Blocks and Adaptive Logic Modules in Cyclone 10 GX Devices Revision History
2. Embedded Memory Blocks in Cyclone 10 GX Devices
2.1. Types of Embedded Memory
2.1.1. Embedded Memory Capacity in Cyclone 10 GX Devices
2.2. Embedded Memory Design Guidelines for Cyclone 10 GX Devices
2.2.1. Consider the Memory Block Selection
2.2.2. Guideline: Implement External Conflict Resolution
2.2.3. Guideline: Customize Read-During-Write Behavior
2.2.3.1. Same-Port Read-During-Write Mode
2.2.3.2. Mixed-Port Read-During-Write Mode
2.2.4. Guideline: Consider Power-Up State and Memory Initialization
2.2.5. Guideline: Control Clocking to Reduce Power Consumption
2.3. Embedded Memory Features
2.4. Embedded Memory Modes
2.4.1. Embedded Memory Configurations for Single-port Mode
2.4.2. Embedded Memory Configurations for Dual-port Modes
2.5. Embedded Memory Clocking Modes
2.5.1. Clocking Modes for Each Memory Mode
2.5.1.1. Single Clock Mode
2.5.1.2. Read/Write Clock Mode
2.5.1.3. Input/Output Clock Mode
2.5.1.4. Independent Clock Mode
2.5.2. Asynchronous Clears in Clocking Modes
2.5.3. Output Read Data in Simultaneous Read/Write
2.5.4. Independent Clock Enables in Clocking Modes
2.6. Parity Bit in Embedded Memory Blocks
2.7. Byte Enable in Embedded Memory Blocks
2.7.1. Byte Enable Controls in Memory Blocks
2.7.2. Data Byte Output
2.7.3. RAM Blocks Operations
2.8. Memory Blocks Packed Mode Support
2.9. Memory Blocks Address Clock Enable Support
2.10. Memory Blocks Asynchronous Clear
2.11. Memory Blocks Error Correction Code Support
2.11.1. Error Correction Code Truth Table
2.12. Embedded Memory Blocks in Cyclone 10 GX Devices Revision History
3. Variable Precision DSP Blocks in Cyclone 10 GX Devices
3.1. Supported Operational Modes in Cyclone 10 GX Devices
3.1.1. Features
3.2. Resources
3.3. Design Considerations
3.3.1. Operational Modes
3.3.2. Internal Coefficient and Pre-Adder for Fixed-Point Arithmetic
3.3.3. Accumulator for Fixed-Point Arithmetic
3.3.4. Chainout Adder
3.3.4.1. Resources
3.3.5. DSP Block Cascade Limit in Agilex™ 7 Devices
3.4. Block Architecture
3.4.1. Input Register Bank
3.4.1.1. Two Sets of Delay Registers for Fixed-Point Arithmetic
3.4.2. Pipeline Register
3.4.3. Pre-Adder for Fixed-Point Arithmetic
3.4.4. Internal Coefficient for Fixed-Point Arithmetic
3.4.5. Multipliers
3.4.6. Adder
3.4.7. Accumulator and Chainout Adder for Fixed-Point Arithmetic
3.4.8. Systolic Registers for Fixed-Point Arithmetic
3.4.9. Double Accumulation Register for Fixed-Point Arithmetic
3.4.10. Output Register Bank
3.5. Operational Mode Descriptions
3.5.1. Operational Modes for Fixed-Point Arithmetic
3.5.1.1. Independent Multiplier Mode
3.5.1.1.1. 18 x 18 or 18 x 19 Independent Multiplier
3.5.1.1.2. 27 x 27 Independent Multiplier
3.5.1.2. Independent Complex Multiplier
3.5.1.2.1. 18 x 19 Complex Multiplier
3.5.1.3. Multiplier Adder Sum Mode
3.5.1.4. 18 x 19 Multiplication Summed with 36-Bit Input Mode
3.5.1.5. Systolic FIR Mode
3.5.1.5.1. Mapping Systolic Mode User View to Variable Precision Block Architecture View
3.5.1.5.2. 18-Bit Systolic FIR Mode
3.5.1.5.3. 27-Bit Systolic FIR Mode
3.5.2. Operational Modes for Floating-Point Arithmetic
3.5.2.1. Single Floating-Point Arithmetic Functions
3.5.2.1.1. Multiplication Mode
3.5.2.1.2. Adder or Subtract Mode
3.5.2.1.3. Multiply Accumulate Mode
3.5.2.2. Multiple Floating-Point Arithmetic Functions
3.5.2.2.1. Multiply-Add or Multiply-Subtract Mode
3.5.2.2.2. Vector One Mode
3.5.2.2.3. Vector Two Mode
3.5.2.2.4. Direct Vector Dot Product
3.5.2.2.5. Complex Multiplication
3.6. Variable Precision DSP Blocks in Cyclone 10 GX Devices Revision History
4. Clock Networks and PLLs in Cyclone 10 GX Devices
4.1. Clock Networks
4.1.1. Clock Resources in Cyclone 10 GX Devices
4.1.2. Hierarchical Clock Networks
4.1.3. Types of Clock Networks
4.1.3.1. Global Clock Networks
4.1.3.2. Regional Clock Networks
4.1.3.3. Periphery Clock Networks
4.1.4. Clock Network Sources
4.1.4.1. Dedicated Clock Input Pins
4.1.4.2. Internal Logic
4.1.4.3. DPA Outputs
4.1.4.4. HSSI Clock Outputs
4.1.4.5. PLL Clock Outputs
4.1.5. Clock Control Block
4.1.5.1. Pin Mapping in Cyclone 10 GX Devices
4.1.5.2. GCLK Control Block
4.1.5.3. RCLK Control Block
4.1.5.4. PCLK Control Block
4.1.6. Clock Power Down
4.1.7. Clock Enable Signals
4.2. Cyclone 10 GX PLLs
4.2.1. PLL Usage
4.2.2. PLL Architecture
4.2.3. PLL Control Signals
4.2.3.1. Reset
4.2.3.2. Locked
4.2.4. Clock Feedback Modes
4.2.5. Clock Multiplication and Division
4.2.6. Programmable Phase Shift
4.2.7. Programmable Duty Cycle
4.2.8. PLL Cascading
4.2.9. Reference Clock Sources
4.2.10. Clock Switchover
4.2.10.1. Automatic Switchover
4.2.10.2. Automatic Switchover with Manual Override
4.2.10.3. Manual Clock Switchover
4.2.10.4. Guidelines
4.2.11. PLL Reconfiguration and Dynamic Phase Shift
4.3. Clock Networks and PLLs in Cyclone 10 GX Devices Revision History
5. I/O and High Speed I/O in Cyclone 10 GX Devices
5.1. I/O and Differential I/O Buffers in Cyclone 10 GX Devices
5.2. I/O Standards and Voltage Levels in Cyclone 10 GX Devices
5.2.1. I/O Standards Support in Cyclone 10 GX Devices
5.2.2. I/O Standards Voltage Levels in Cyclone 10 GX Devices
5.3. Altera FPGA I/O IP Cores for Cyclone 10 GX Devices
5.4. I/O Resources in Cyclone 10 GX Devices
5.4.1. GPIO Banks, SERDES, and DPA Locations in Cyclone 10 GX Devices
5.4.2. FPGA I/O Resources in Cyclone 10 GX Packages
5.4.3. I/O Banks Groups in Cyclone 10 GX Devices
5.4.4. I/O Vertical Migration for Cyclone 10 GX Devices
5.4.4.1. Verifying Pin Migration Compatibility
5.5. Architecture and General Features of I/Os in Cyclone 10 GX Devices
5.5.1. I/O Element Structure in Cyclone 10 GX Devices
5.5.1.1. I/O Bank Architecture in Cyclone 10 GX Devices
5.5.1.2. I/O Buffer and Registers in Cyclone 10 GX Devices
5.5.2. Features of I/O Pins in Cyclone 10 GX Devices
5.5.2.1. Open-Drain Output
5.5.2.2. Bus-Hold Circuitry
5.5.2.3. Weak Pull-up Resistor
5.5.3. Programmable IOE Features in Cyclone 10 GX Devices
5.5.3.1. Programmable Current Strength
5.5.3.2. Programmable Output Slew Rate Control
5.5.3.3. Programmable IOE Delay
5.5.3.4. Programmable Open-Drain Output
5.5.3.5. Programmable Pre-Emphasis
5.5.3.6. Programmable Differential Output Voltage
5.5.4. On-Chip I/O Termination in Cyclone 10 GX Devices
5.5.4.1. RS OCT without Calibration in Cyclone 10 GX Devices
5.5.4.2. RS OCT with Calibration in Cyclone 10 GX Devices
5.5.4.3. RT OCT with Calibration in Cyclone 10 GX Devices
5.5.4.4. Dynamic OCT
5.5.4.5. Differential Input RD OCT
5.5.4.6. OCT Calibration Block in Cyclone 10 GX Devices
5.5.5. External I/O Termination for Cyclone 10 GX Devices
5.5.5.1. Single-Ended I/O Termination
5.5.5.2. Differential I/O Termination for Cyclone 10 GX Devices
5.5.5.2.1. Differential HSTL, SSTL, HSUL, and POD Termination
5.5.5.2.2. LVDS, RSDS, and Mini-LVDS Termination
5.5.5.2.3. LVPECL Termination
5.6. High Speed Source-Synchronous SERDES and DPA in Cyclone 10 GX Devices
5.6.1. Cyclone 10 GX LVDS SERDES Usage Modes
5.6.2. SERDES Circuitry
5.6.3. SERDES I/O Standards Support in Cyclone 10 GX Devices
5.6.4. Differential Transmitter in Cyclone 10 GX Devices
5.6.4.1. Transmitter Blocks in Cyclone 10 GX Devices
5.6.4.2. Serializer Bypass for DDR and SDR Operations
5.6.5. Differential Receiver in Cyclone 10 GX Devices
5.6.5.1. Receiver Blocks in Cyclone 10 GX Devices
5.6.5.1.1. DPA Block
5.6.5.1.2. Synchronizer
5.6.5.1.3. Data Realignment Block (Bit Slip)
5.6.5.1.4. Deserializer
5.6.5.2. Receiver Modes in Cyclone 10 GX Devices
5.6.5.2.1. Non-DPA Mode
5.6.5.2.2. DPA Mode
5.6.5.2.3. Soft-CDR Mode
5.6.6. PLLs and Clocking for Cyclone 10 GX Devices
5.6.6.1. Clocking Differential Transmitters
5.6.6.2. Clocking Differential Receivers
5.6.6.2.1. Guideline: Clocking DPA Interfaces Spanning Multiple I/O Banks
5.6.6.2.2. Guideline: I/O PLL Reference Clock Source for DPA or Non-DPA Receiver
5.6.6.3. Guideline: LVDS Reference Clock Source
5.6.6.4. Guideline: Use PLLs in Integer PLL Mode for LVDS
5.6.6.5. Guideline: Use High-Speed Clock from PLL to Clock LVDS SERDES Only
5.6.6.6. Guideline: Pin Placement for Differential Channels
5.6.6.7. LVDS Interface with External PLL Mode
5.6.6.7.1. IOPLL IP Signal Interface with LVDS SERDES IP
5.6.6.7.2. IOPLL Parameter Values for External PLL Mode
5.6.6.7.3. Connection between IOPLL and LVDS SERDES in External PLL Mode
5.6.7. Timing and Optimization for Cyclone 10 GX Devices
5.6.7.1. Source-Synchronous Timing Budget
5.6.7.1.1. Differential Data Orientation
5.6.7.1.2. Differential I/O Bit Position
5.6.7.1.2.1. Differential Bit Naming Conventions
5.6.7.1.3. Transmitter Channel-to-Channel Skew
5.6.7.1.4. Receiver Skew Margin for Non-DPA Mode
5.6.7.1.4.1. RSKM Equation
5.7. Using the I/Os and High Speed I/Os in Cyclone 10 GX Devices
5.7.1. I/O and High-Speed I/O General Guidelines for Cyclone 10 GX Devices
5.7.1.1. Guideline: VREF Sources and VREF Pins
5.7.1.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing
5.7.1.3. Guideline: I/O Standards Supported for I/O PLL Reference Clock Input Pin
5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards
5.7.2.1. Non-Voltage-Referenced I/O Standards
5.7.2.2. Voltage-Referenced I/O Standards
5.7.2.3. Mixing Voltage-Referenced and Non-Voltage Referenced I/O Standards
5.7.3. Guideline: Maximum Current Driving I/O Pins While Turned Off and During Power Sequencing
5.7.4. Guideline: Maximum DC Current Restrictions
5.7.5. Guideline: LVDS SERDES IP Core Instantiation
5.7.6. Guideline: LVDS SERDES Pin Pairs for Soft-CDR Mode
5.7.7. Guideline: Minimizing High Jitter Impact on Cyclone 10 GX GPIO Performance
5.7.8. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
5.8. I/O and High Speed I/O in Cyclone 10 GX Devices Revision History
6. External Memory Interfaces in Cyclone 10 GX Devices
6.1. Key Features of the Cyclone 10 GX External Memory Interface Solution
6.2. Memory Standards Supported by Cyclone 10 GX Devices
6.3. External Memory Interface Widths in Cyclone 10 GX Devices
6.4. External Memory Interface I/O Pins in Cyclone 10 GX Devices
5.7.8. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
6.5. Memory Interfaces Support in Cyclone 10 GX Device Packages
6.5.1. Cyclone 10 GX Package Support for DDR3/DDR3L x40 with ECC or LPDDR3 x32 without ECC
6.5.2. Cyclone 10 GX Package Support for DDR3/DDR3L ×72 with ECC Single and Dual-Rank
6.6. External Memory Interface IP Support in Cyclone 10 GX Devices
6.6.1. Ping Pong PHY IP
6.7. External Memory Interface Architecture of Cyclone 10 GX Devices
6.7.1. I/O Bank
6.7.1.1. Hard Memory Controller
6.7.1.1.1. Hard Memory Controller Features
6.7.1.1.2. Main Control Path
6.7.1.1.3. Data Buffer Controller
6.7.1.2. Delay-Locked Loop
6.7.1.3. Sequencer
6.7.1.4. Clock Tree
6.7.1.5. I/O Lane
6.7.1.5.1. DQS Logic Block
6.7.1.5.1.1. DQS Delay Chain
6.7.2. I/O AUX
6.8. External Memory Interfaces in Cyclone 10 GX Devices Revision History
7. Configuration, Design Security, and Remote System Upgrades in Cyclone 10 GX Devices
7.1. Enhanced Configuration and Configuration via Protocol
7.2. Configuration Schemes
7.2.1. Active Serial Configuration
7.2.1.1. DATA Clock (DCLK)
7.2.1.2. Active Serial Single-Device Configuration
7.2.1.3. Active Serial Multi-Device Configuration
7.2.1.3.1. Pin Connections and Guidelines
7.2.1.3.2. Using Multiple Configuration Data
7.2.1.4. Active Serial Configuration with Multiple EPCQ-L Devices
7.2.1.5. Using EPCQ-L Devices
7.2.1.5.1. Controlling EPCQ-L Devices
7.2.1.5.2. Trace Length Guideline
7.2.1.5.3. Programming EPCQ-L Devices
7.2.1.5.3.1. Programming EPCQ-L Using the JTAG Interface
7.2.1.5.3.2. Programming EPCQ-L Using the Active Serial Interface
7.2.2. Passive Serial Configuration
7.2.2.1. Passive Serial Single-Device Configuration Using an External Host
7.2.2.2. Passive Serial Single-Device Configuration Using an Intel FPGA Download Cable
7.2.2.3. Passive Serial Multi-Device Configuration
7.2.2.3.1. Pin Connections and Guidelines
7.2.2.3.2. Using Multiple Configuration Data
7.2.2.3.3. Using One Configuration Data
7.2.2.3.4. Using PC Host and Download Cable
7.2.3. Fast Passive Parallel Configuration
7.2.3.1. Fast Passive Parallel Single-Device Configuration
7.2.3.2. Fast Passive Parallel Multi-Device Configuration
7.2.3.2.1. Pin Connections and Guidelines
7.2.3.2.2. Using Multiple Configuration Data
7.2.3.2.3. Using One Configuration Data
7.2.4. JTAG Configuration
7.2.4.1. JTAG Single-Device Configuration
7.2.4.2. JTAG Multi-Device Configuration
7.2.4.2.1. Pin Connections and Guidelines
7.2.4.2.2. Using a Download Cable
7.3. Configuration Details
7.3.1. MSEL Pin Settings
7.3.2. CLKUSR
7.3.3. Configuration Sequence
7.3.3.1. Power Up
7.3.3.2. Reset
7.3.3.3. Configuration
7.3.3.3.1. Configuration Error Detection
7.3.3.4. Configuration Error Handling
7.3.3.5. Initialization
7.3.3.6. User Mode
7.3.4. Configuration Timing Waveforms
7.3.4.1. FPP Configuration Timing
7.3.4.2. AS Configuration Timing
7.3.4.3. PS Configuration Timing
7.3.5. Estimating Configuration Time
7.3.6. Device Configuration Pins
7.3.6.1. I/O Standards and Drive Strength for Configuration Pins
7.3.6.2. Configuration Pin Options in the Quartus Prime Pro Edition Software
7.3.7. Configuration Data Compression
7.3.7.1. Enabling Compression Before Design Compilation
7.3.7.2. Enabling Compression After Design Compilation
7.3.7.3. Using Compression in Multi-Device Configuration
7.4. Remote System Upgrades Using Active Serial Scheme
7.4.1. Configuration Images
7.4.2. Configuration Sequence in the Remote Update Mode
7.4.3. Remote System Upgrade Circuitry
7.4.4. Enabling Remote System Upgrade Circuitry
7.4.5. Remote System Upgrade Registers
7.4.5.1. Control Register
7.4.5.2. Status Register
7.4.6. Remote System Upgrade State Machine
7.4.7. User Watchdog Timer
7.5. Design Security
7.5.1. Security Key Types
7.5.2. Security Modes
7.5.2.1. JTAG Secure Mode
7.5.3. Cyclone 10 GX Qcrypt Security Tool
7.5.4. Design Security Implementation Steps
7.6. Configuration, Design Security, and Remote System Upgrades in Cyclone 10 GX Devices Revision History
8. SEU Mitigation for Cyclone 10 GX Devices
8.1. Mitigating Single Event Upset
8.1.1. Configuration RAM
8.1.2. Embedded Memory
8.1.3. Failure Rates
8.2. Cyclone 10 GX SEU Mitigation Techniques
8.2.1. Mitigating SEU Effects in Configuration RAM
8.2.1.1. Error Detection Cyclic Redundancy Check
8.2.1.1.1. Column-Based and Frame-Based Check-Bits
8.2.1.1.2. Error Message Register
8.2.1.1.2.1. Retrieving Error Information
8.2.1.1.2.2. Error Type in EMR
8.2.1.1.3. CRC_ERROR Pin Behavior
8.2.1.2. SEU Sensitivity Processing
8.2.1.3. Hierarchy Tagging
8.2.1.4. Evaluating Your System’s Response to Functional Upsets
8.2.1.5. Recovering from CRC Errors
8.2.1.5.1. Enabling Error Correction (Internal Scrubbing)
8.2.2. Mitigating SEU Effects in Embedded User RAM
8.2.2.1. Configuring RAM to Enable ECC
8.2.3. Triple-Module Redundancy
8.2.4. Quartus Prime Pro Edition Software SEU FIT Reports
8.2.4.1. SEU FIT Parameters Report
8.2.4.2. Projected SEU FIT by Component Usage Report
8.2.4.2.1. Component FIT Rates
8.2.4.2.2. Raw FIT
8.2.4.2.3. Utilized FIT
8.2.4.2.3.1. Comparing .smh Critical Bits Report to Utilized Bit Count
8.2.4.2.3.2. Considerations for Small Designs
8.2.4.2.4. Mitigated FIT
8.2.4.2.5. Architectural Vulnerability Factor
8.2.4.3. Enabling the Projected SEU FIT by Component Usage Report
8.3. CRAM Error Detection Settings Reference
8.4. Specifications
8.4.1. Error Detection Frequency
8.4.2. Error Detection Time
8.4.3. EMR Update Interval
8.4.4. Error Correction Time
8.5. SEU Mitigation for Cyclone 10 GX Devices Revision History
9. JTAG Boundary-Scan Testing in Cyclone 10 GX Devices
9.1. BST Operation Control
9.1.1. IDCODE
9.1.2. Supported JTAG Instruction
9.1.3. JTAG Secure Mode
9.1.4. JTAG Private Instruction
9.2. I/O Voltage for JTAG Operation
9.3. Performing BST
9.4. Enabling and Disabling IEEE Std. 1149.1 BST Circuitry
9.5. Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing
9.6. IEEE Std. 1149.1 Boundary-Scan Register
9.6.1. Boundary-Scan Cells of a Cyclone 10 GX Device I/O Pin
9.7. IEEE Std. 1149.6 Boundary-Scan Register
9.8. JTAG Boundary-Scan Testing in Cyclone 10 GX Devices Revision History
10. Power Management in Cyclone 10 GX Devices
10.1. Power Consumption
10.1.1. Dynamic Power Equation
10.2. Programmable Power Technology
10.3. Power Sense Line
10.4. Voltage Sensor
10.4.1. Input Signal Range for External Analog Signal
10.4.1.1. Unipolar Input Mode
10.4.2. Using Voltage Sensor in Cyclone 10 GX Devices
10.4.2.1. Accessing the Voltage Sensor Using FPGA Core Access
10.4.2.1.1. Configuration Registers for the Core Access Mode
10.4.2.1.2. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is not Equal to 2'b11
10.4.2.1.3. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is Equal to 2'b11
10.4.2.2. Voltage Sensor Transfer Function
10.5. Temperature Sensing Diode
10.5.1. Internal Temperature Sensing Diode
10.5.1.1. Transfer Function for Internal TSD
10.5.2. External Temperature Sensing Diode
10.6. Power-On Reset Circuitry
10.6.1. Power Supplies Monitored and Not Monitored by the POR Circuitry
10.7. Power Sequencing Considerations for Cyclone 10 GX Devices
10.7.1. Power-Up Sequence Requirements for Cyclone 10 GX Devices
10.7.2. Power-Down Sequence Recommendations and Requirements for Cyclone 10 GX Devices
10.8. Power Supply Design
10.9. Power Management in Cyclone 10 GX Devices Revision History